Closeup of one of the new 4,000-word by 25-bit plated tungsten wire memory arrays during assembly at the Aerospace Electronic Systems Department of General Electric's Aircraft Equipment Division, Utica, N.Y. Based on wire electropating process developed at the GE Research and Development Center, Schenectady, N.Y. the new memory array is four times smaller and lighter than conventional plated wire memories and required only half the drive energy. The two-and-a-half mil tungsten wire - about the diameter of a human hair - is threaded through the plastic tunnel structure in upper portion of the memory array.
Photo measures 10 x 8 inches.
Photo is dated 04-04-1973.
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